
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9
12 Freescale Semiconductor
I/O supply voltage, GPIO
CRM,LCDC,JTAG,MISC
NV
DD_GPIO2
3.0 3.3 3.6 —
I/O supply voltage DDR (Mobile DDR mode)
EMI1, EMI2
NV
DD_MDDR
1.75 — 1.95 V
I/O supply voltage DDR (DDR2 mode)
EMI1,EMI2
NV
DD_DDR2
1.75 — 1.9 V
I/O supply voltage DDR (SDRAM mode)
EMI1,EMI2
NV
DD_SDRAM
1.75 — 3.6 V
Supply of USBPHY1 (HS)
USBPHY1_VDDA_BIAS, USBPHY1_UPLL_VDD,USBPHY1_VDDA
V
DD_usbphy1
3.17 3.3 3.43 V
Supply of USBPHY2 (FS)
USBPHY2_VDD
V
DD_usbphy2
3.0 3.3 3.6 V
Supply of OSC24M
OSC24M_VDD
V
DD_OSC24M
3.0 3.3 3.6 V
Supply of PLL
MPLL_VDD,UPLL_VDD
V
DD_PLL
1.4 — 1.65 V
Supply of touchscreen ADC
NVCC_ADC
V
DD_tsc
3.0 3.3 3.6 V
External reference of touchscreen ADC
Ref
Vref 2.5 V
DD_tsc
V
DD_tsc
V
Fusebox program supply voltage
FUSE_VDD
2
FUSEV
DD
(program mode)
3.3 ± 5% — 3.6 V
Supply output
3
NVCC_DRYICE
V
DD_
1.0 — 1.55 V
Operating ambient temperature T
A
–40 — 85
o
C
1
V
DD_BAT
must always be powered by battery in security application. In non-security case, V
DD_BAT
can be connected to
QV
DD
.
2
The fusebox read supply is connected to supply of the full speed USBPHY2_VDD. FUSE_VDD is only used for programming.
It is recommended that FUSE_VDD be connected to ground when not being used for programming. See Table 7 for current
parameters.
3
NVCC_DRYICE is a supply output. An external capacitor no less than 4 µF must be connected to it. A 4.7 µF capacitor is
recommended.
Table 6. DC Operating Conditions (continued)
Parameter Symbol Min. Typ. Max. Units
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